ADLINK Technology’s Post

In this recent article from Semiconductor Engineering, Greg Prewitt, PDF Solutions product management director of Exensio Test Operations, explains what is required to implement Adaptive Testing in the #semiconductor Industry “State of the art adaptive test requires adopters to choreograph the movement of data through a complex ecosystem where data is collected from geographically diverse test operations, multiple test steps, and potentially multiple devices. PDF’s Exensio platform enables customers to automate the collection, transformation and delivery of this data for use in subsequent test operations.” https://lnkd.in/gaZvD54h

The Future of Growing Semiconductor Technologies Dive deep into this Blog Insights @ https://lnkd.in/gkmxJzQJ   #semiconductortechnologies #semiconductorindustry #researchnester

As AI advances, so do its demands, and many technology companies rely on high bandwidth memory (HBM) to meet them. Learn how semiconductor manufacturing etch and deposition and advanced packaging may help us realize the promise of HBM in the Semiconductor Digest article from Lam Research Senior Director Chee Ping Lee. #LifeAtLam

The #semiconductor world is evolving with chiplets, offering a new way to build #microchips beyond traditional SoCs. This shift is unlocking new possibilities for users and industries alike. Explore the impact of this innovation: https://t.co/eVYZuYU2Lp #ExpertConnect https://t.co/X5iEbohouh

Exciting news for the tech industry! The semiconductor shortage is finally starting to ease up, bringing promising changes in technology. 🎉💻🔌💡 #technology #ManufacturingComponents #semiconductor #chipshortages Read more about it here: https://okt.to/CQTvhc

I would like to invite you to our next webinar: 𝗚𝗲𝗻𝗔𝗜 – 𝘁𝗵𝗲 𝗻𝗲𝘅𝘁 𝗦 𝗰𝘂𝗿𝘃𝗲 𝗳𝗼𝗿 𝘁𝗵𝗲 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝘆?, as part of our Future of Semiconductors Webinar Series. Generative artificial intelligence (GenAI) applications are becoming increasingly popular and with new model and applications being currently launched every day. However, GenAI applications are very compute intensive requiring specialized servers and chips. In this webinar, we will discuss different adoptions scenarios and their implications on the semiconductor industry. In particular, we will dive deep on the need for additional manufacturing capacity for logic and memory as we expect the biggest investment needs there. 📅 Wednesday, February 21 ⌚ 10 am ET / 4 pm CET 🔊 Ondrej Burkacky, Dr. Klaus Pototzky, Wenyi (Wendy) Zhu REGISTER HERE: https://lnkd.in/e35CQ8rA #semiconductor #GenAI #generativeai #mckinsey

As AI advances, so do its demands, and many technology companies rely on high bandwidth memory (HBM) to meet them. Learn how semiconductor manufacturing etch and deposition and advanced packaging may help us realize the promise of HBM in the Semiconductor Digest article from Lam Research Senior Director Chee Ping Lee. #LifeAtLam

As AI advances, so do its demands, and many technology companies rely on high bandwidth memory (HBM) to meet them. Learn how semiconductor manufacturing etch and deposition and advanced packaging may help us realize the promise of HBM in the Semiconductor Digest article from Lam Research Senior Director Chee Ping Lee. #LifeAtLam

SandBox Semiconductor is Accelerating and Reducing the Cost of Semiconductor Process Development https://lnkd.in/d-KeH5Kq Following a spurt of semi-fab-related articles, we are poised to plunge into the semiconductor fabrication fray once more (I hope you are suitably attired).

Chiplets: The End of the Monolithic Age of Silicon Today, the movers and shakers of the semiconductor industry are no longer putting all of their transistors in one chip. Instead, they’re pulling apart their largest, most advanced chips into smaller silicon die referred to as chiplets. These can be made on the best process technology for the job and then repackaged to mimic a single monolithic system-on-chip (SoC). By integrating the heterogeneous die in a single package, such “multi-die” systems bring more performance to the table for everything from AI to RF.